Solving heat issues in data centers! Heat dissipation sheet processing.
We offer a one-stop solution for thermal management sheets ideal for CPUs and GPUs, from material selection to shape processing and mass production supply.
With the increasing performance of AI servers and high-performance servers, the heat generation from components such as CPUs and GPUs has risen, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or enclosure. At our company, we provide one-stop solutions from selecting thermal interface materials based on heat generation, gaps, and usage environments, to shape processing tailored to the installation locations. We offer solutions for thermal challenges in various heat-generating areas, including CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power units, and circuit boards/enclosures.
- Company：五輪パッキング
- Price：Other
